Device Characterization Service Package! Outsourced Semiconductor Test Service
YuChen Technologies provided three sets of solutions - Packaged Device Dynamics Analyzer, Wafer Probing Device Dynamics Analyzer and Dynamic Reliability Analyzer. Besides, we also provided the Device Characterization Service Package!
Device Characterization Service Package
Basic Dynamics Package
◆ 1 DUT/ per Test
◆ Static Test Project
DC Vth/Ron、CV Curve、DC BVdss
◆ Dynamic Test Project
Dynamic Rdson、Vth、Vsd
◆ Measuring Temperature
- Room Temp.、High Temp.
- Adjustable range: 25°C - 175°C
◆ Design elastic measurement conditions according to the characteristics of user components
Temperature、Voltage、Curret、Frequency、Duty、Vgs
Advanced Dynamics Package
◆ 1 DUT/ per Test
◆ Static Test Project
The same as basic dynamics package, Static measurement before and after HTOL
◆ Dynamic Test Project
- The same as basic dynamics package, Room Temp. and High Temp. before and after HTOL
- Provided dynamic reliability of HTOL analysis
◆ Measuring Temperature
- Room Temp.、High Temp.
- Adjustable range: 25°C - 175°C
◆ HTOL Measuring Time and Stop Condition
- The measurement time takes 12 hours as the minimum pricing unit
- Stop condition: specific time or specific dynamic Rdson resistance
◆ Design elastic measurement conditions according to the characteristics of user components
Temperature、Voltage、Curret、Frequency、Duty、Vgs、HTOL Time
Basic Dynamic Reliability Package
◆ 10 DUT/ per Test
◆ Static Test Project
The same as basic dynamics package, Static measurement before and after HTOL
◆ Dynamic Test Project
- Provided dynamic reliability of HTOL analysis(10 DUT)
- Not include Dynamic Rdson、Vth、Vsd
◆ Measuring Temperature
- Room Temp.、High Temp.
- Adjustable range: 25°C - 175°C
◆ HTOL Measuring Time and Stop Condition
- The measurement time takes 12 hours as the minimum pricing unit
- Stop condition: specific time or specific dynamic Rdson resistance◆ Design elastic measurement conditions according to the characteristics of user components
Temperature、Voltage、Curret、Frequency、Duty、Vgs、HTOL Time
Advanced Dynamic Reliability Package
◆ 10 DUT/ per Test
◆ Static Test Project
Same as basic dynamics package, Static measurement before and after HTOL
◆ Dynamic Test Project
- Same as basic dynamics package, Room Temp. and High Temp. before and after HTOL
- Provided dynamic reliability of HTOL analysis(10 DUT)
◆ Measuring Temperature
- Room Temp.、High Temp.
- Adjustable range: 25°C - 175°C
◆ HTOL 量測時間與停止條件
- The measurement time takes 12 hours as the minimum pricing unit
- Stop condition: specific time or specific dynamic Rdson resistance◆ Design elastic measurement conditions according to the characteristics of user components
Temperature、Voltage、Curret、Frequency、Duty、Vgs、HTOL Time
- What We Offer -
Basic Dynamics Package
• Static Characterization
1. RT Vth/Ron
2. RT CV curve
3. RT BVdss
• Dynamic Characterization
1. RT/HT Dynamic Rdson
2. RT/HT Dynamic Vth
3. RT/HT Dynamic Vsd
Advanced Dynamics Package
• Characterization
1. RT static characterization before DHTOL
2. RT/HT Dynamic Rdson before DHTOL
3. RT/HT Dynamic Vth before DHTOL
4. RT/HT Dynamic Vsd before DHTOL
5. RT/HT Dynamic Rdson post DHTOL
6. RT/HT Dynamic Vth post DHTOL
7. RT/HT Dynamic Vsd post DHTOL
8. RT static characterization post DHTOL
• Dynamic HTOL
1. HT Dynamic HTOL
Basic Dynamic Reliability Package
• Static Characterization
1. RT Ron/Vth before DHTOL
2. RT BVdss before DHTOL
3. RT Ron/Vth post DHTOL
4. RT BVdss post DHTOL
• Dynamic HTOL
1. HT Dynamic Reliability HTOL * 10DUT
Advanced Dynamic Reliability Package
• Static Characterization
1. RT Ron/Vth before DHTOL
2. RT BVdss before DHTOL
3. RT Ron/Vth post DHTOL
4. RT BVdss post DHTOL
• Dynamic Characterization
1. RT/HT Dynamic Rdson before DHTOL
2. RT/HT Dynamic Vth before DHTOL
3. RT/HT Dynamic Vsd before DHTOL
4. RT/HT Dynamic Rdson post DHTOL
5. RT/HT Dynamic Vth post DHTOL
6. RT/HT Dynamic Vsd post DHTOL
• Dynamic HTOL
1. HT Dynamic Reliability HTOL * 10DUT
Three analysis systems designed for dynamic analysis of Gallium Nitride
We provide total solution for measuring Dynamic Rdson, Dynamic Vth and Dynamic Vsd from trapping effect of Gallium Nitride. In addition to package, wafer-level GaN HV+HP dynamic measurement, there is also Device Dynamic Reliability Analyzer for extracting dynamics reliability under independent factor acceleration. The three solutions can easily exam packages, wafers and even multiple-DUT under programmable switching condition.
For package: DDA8010 Device Dynamics Analyzer
On-wafer: WPDDA6505 Wafer Probing Device Dynamics Analyzer
DDL coworking with MPI’s probe station realizes wafer-level GaN HV + HP dynamic measurement, which can automatically or manually position the wafers, and has a built-in temperature control system to achieve more efficient wafer-level dynamic measurement at different temperatures.
For reliability: DDRA8010 Device Dynamic Reliability Analyzer
The dynamic characteristics of multiple GaN components can be tested at the same time, and the lifetime of GaN under real system operation can be evaluated by using Temperature, Voltage, Current (Esw), Frequency or Duty to accelerate GaN device aging which can ensure the stability and availability of the GaN product.
The actual testing videos
We provide total solution for measuring Dynamic Rdson, Dynamic Vth and Dynamic Vsd from trapping effect of Gallium Nitride. In addition to package, wafer-level GaN HV+HP dynamic measurement, there is also Device Dynamic Reliability Analyzer for extracting dynamics reliability under independent factor acceleration. The three solutions can easily exam packages, wafers and even multiple-DUT under programmable switching condition. Check the actual videos!